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Module Ipese Agbara to gaju T1

Apejuwe kukuru:

Package ọja: T1

Ifarahan: Fọọmu iṣakojọpọ lọwọlọwọ giga tinrin, lilo mimọ-giga, resini iposii iwọn otutu fun iṣakojọpọ, imudarasi agbara ẹrọ ati resistance ọrinrin, imudara agbara ati igbẹkẹle giga. O jẹ lilo pupọ julọ ni yiyipada ipese agbara, oluyipada, aabo asopọ ipakokoro batiri ati awọn ohun elo miiran.


Alaye ọja

Mimojuto esi akoko

Iwọn iwọn

ọja Tags

Awọn anfani ti Module Ipese Agbara YUNYI T1:

1. Idije idiyele pẹlu didara ipele giga.

2. Ṣiṣe iṣelọpọ giga pẹlu akoko kukuru kukuru.

3. Idurosinsin ati ki o gbẹkẹle labẹ orisirisi awọn adayeba ayika.

4. Iwọn kekere, ṣe iranlọwọ lati mu aaye igbimọ agbegbe naa dara

T1

Awọn ilana iṣelọpọ Chip:

1. Mechanically Printing (Super-konge laifọwọyi wafer titẹ sita)

2. Laifọwọyi akọkọ-etching (Awọn ohun elo Etching Aifọwọyi, CPK> 1.67)

3. Idanwo Polarity Aifọwọyi (Iyẹwo Polarity gangan)

4. Apejọ Aifọwọyi (Apejọ Aifọwọyi Aifọwọyi ti ara ẹni ti dagbasoke)

5. Soldering (Idaabobo pẹlu Adalu ti Nitrogen & Hydrogen Vacuum Soldering)

6. Etching Keji Aifọwọyi (Etching Keji Aifọwọyi pẹlu Omi Pure-pure)

7. Ipara Aifọwọyi (Ṣiṣiro Aṣọ & Iṣiro Itọkasi ti wa ni Imudani nipasẹ Awọn ohun elo Itọpa Aifọwọyi Aifọwọyi)

8. Idanwo Ooru Aifọwọyi (Aṣayan Aifọwọyi nipasẹ Oluyẹwo Gbona)

9. Idanwo Aifọwọyi(Onidanwo Alapọlọpọ)

芯片组装
芯片检测

Awọn paramita:

Nọmba apakan Package VRWM
V
IO
A
IFSM
A
IR
Ma
VF
V
Trr
ns
SM090KD800G1 T1 800 90 2000 0.02 1.05 -
SM090KE800G1 T1 800 90 2000 0.02 1.05 -
SM090KC800G1 T1 800 90 2000 0.02 1.05 -
SM090KJ800G1 T1 800 90 2000 0.02 1.05 -

 


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